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1、硅片切割工藝講義 主要內容1、車間流程的介紹2、Squarer的介紹3、Cropping Saw的介紹4、Grinder的介紹5、gluing Brick 的介紹6、Wire Saw7、Cleaning Station的介紹 1、車間流程的介紹Building 1 Layout 2、SQUARER的介紹 3、Cropping Saw BAND SAWnSlice usable length of brick by cropping top in ultrasonic cleaning, this agitation is caused by cavitations. Ultrasonic ca
2、vitations produces more energy to remove particles than does low pressure spray cleaning. n Cavitations refers to the generation, growth, and subsequent violent collapse of vapor bubbles.n The collapse of bubbles produces shock waves which scrub particles from that surface. n Choosing 40 kHz frequency generators; the higher the frequency, the more gentle the ultrasonic cleaning action. Unlike the 25 kHz used in industrial cleaning, the higher frequency (40 kHz) “softens” cavitations To avoid etching. Wafer cleaning* Wafer cleaning Movie
硅片切割工藝講義
